Product name:10-(2,5-Dihydroxyphenyl)-10H-9-oxa-10-phospha-phenantbrene-10-oxide

Synonyms:DOPO-HQ; ODOPB

CAS:99208-50-1

MF:C18H13O4P

MW:324.28

EINECS:619-409-6

Density:1.38-1.4 g/cm3

Melting point:245-253°C

Packaging:25 kg/bag, 25 kg/drum

Solubility:Easily soluble in DMSO and DMF, soluble in methanol and acetone, insoluble in toluene and petroleum ether.

DOPO-HQ, as a new type of halogen-free flame retardant, is mainly used for flame retardant treatment of polymer materials such as epoxy resin, polyamide, polyurethane, as well as plastics and circuit boards for electronic devices. It can replace traditional bromine containing flame retardants (such as Tetrabromobisphenol A) and meets ROHS environmental protection requirements. ‌
Main application areas
1.Electronic device packaging:
DOPO-HQ is used for flame retardant treatment of semiconductor packaging materials, printed circuit boards (PCBs), and LED light-emitting tubes, improving the material's heat resistance, insulation, and low volatility. ‌
2.Epoxy resin modification:
DOPO-HQ, as a reactive flame retardant intermediate, can improve the flame retardancy and dielectric properties of bisphenol A epoxy resin, making it suitable for high demand electrical insulation materials. ‌
3.Polymer materials:
DOPO-HQ is suitable for polymer materials such as polyamide and polyurethane, enhancing their flame retardancy and thermal stability. ‌
4.Other fields:
DOPO-HQ also has applications in anti coloring agents, luminescent materials, and modified materials, such as improving the water resistance and oxidation resistance of materials.

Store in a cool, dry, well ventilated place; Avoid high temperatures and direct sunlight.